11:15
Design strategies to address the chip shortage crisis
Speaker: Leonardo Costa – Cognimade Srl |
14:30
The Future of PCB Value Chains – From First-Time-Right-Design to Predictive Sourcing
Speaker: Philipp König – Luminovo GmbH |
11:45
MEC = 360° of services Speaker: Alessio Cartella – MEC |
15:00
RO4450TTM and SpeedwaveTM 300P: new prepregs and bonding films from Rogers for high layer count applications and sequential lamination.
Speaker: Stefano Dada’ – Rogers/Dralmi |
12:45
How to secure the manufacturing of your electronic board projects?
Speaker: Pierre-Yves SEMPERE – EMS Factory |
16:00
Laser Depaneling by LPKF
Speaker: Daniele Pavani – ATG Electronics |
14:00
|
16:30
Brady on PCB
Speaker: Marco Minotti – Brady Italia |
11:15
14:30
11:45
15:00
12:15
15:30
12:45
16:00
14:00
16:30
11:15
Design strategies to address the chip shortage crisis
Speaker: Leonardo Costa – Cognimade Srl |
11:45
MEC = 360° of services Speaker: Alessio Cartella – MEC |
12:15
Additive Manufacturing and Metal Clad for Microwave
Speaker: Paolo Leoni – Elco |
12:45
How to secure the manufacturing of your electronic board projects?
Speaker: Pierre-Yves SEMPERE – EMS Factory |
14:00
14:30
The Future of PCB Value Chains – From First-Time-Right-Design to Predictive Sourcing
Speaker: Philipp König – Luminovo GmbH |
15:00
RO4450TTM and SpeedwaveTM 300P: new prepregs and bonding films from Rogers for high layer count applications and sequential lamination.
Speaker: Stefano Dada’ – Rogers/Dralmi |
15:30
Cadence AWR: integrated solutions to design and simulate RF and microwave circuits
Speaker: Luigi Scopelliti – Artedas |
16:00
Laser Depaneling by LPKF
Speaker: Daniele Pavani – ATG Electronics |
16:30
Brady on PCB
Speaker: Marco Minotti – Brady Italia |
11:15
11:45
12:15
12:45
14:00
14:30
15:00
15:30
16:00
16:30