Wednesday, 17th May 2023 – 1st Day
Schedule
Morning
Afternoon
09:30
| CADENCE MSA (Multiphysics System Analysis) for integrated design od Radio Frequency and Microwave PCBs.
Speaker: Luigi Scopelliti, ARTEDAS |
14:00
| The evolution of PCB Design.
Speaker: Alessandro Checchia, ACx Design Srl |
10:00
| Automated printing systems, label’s materials.
Speaker: Marco Minotti, BRADY ITALIA Srl |
14:30
| State-of-the-art PCB drilling and milling solutions.
Speaker: Michael Rohrer, Atg electronics Srl SB |
10:30
| Micro-controllers market overview and its evolution during the chip-shortage.
Speaker: Leonardo Costa, Cognimade Srl |
15:00
| EPA Area.
Speaker: Nicoletta Frignani, Batter Fly Srl |
11:00
| The importance of technology, the right solutions and partnership.
Speaker: Eric Jon Tonel, JO-TECH Srl |
15:30
| All starts from Design”: how the electronic design has changed and which are the new challenges.
Speaker: Pietro Vergine, Leading Edge |
11:30
| Ultra-High Density Interconnects- Mils to Microns.
Speaker: Anaya Vardya, American Standard Circuits |
16:00
| Mass Interconnect systems for IC and PCBA testing. Speaker: Paolo Magni, ODU GmbH & Co. KG |
12:00
| Gestlabs & Phoenix Contact: the ideal partnership for higher added value training.
Speaker: Patrick Panci, PHOENIX CONTACT SpA |
16:30
| Characterizing the impedance profile on printed circuit boards using the tdr technique.
Speaker: Maurizio Mastrofini, TELEDYNE LECROY Srl |
12:30
| PCB, is one as good as the other?
Speaker: Gianni Quartiroli, BASELECTRON |
17:00
| Reducing bom cost offering an a.s.i.c. solution.
Speaker: Andrea Stona, KERR Srl |
BREAK 13:00 – 14:00
17:30
| Controlled processes for longer lasting electronic products.
Speaker: Graziano Todaro, EES SpA |
Thursday, 18th May 2023 – 2nd Day
Schedule
Morning
Afternoon
09:00
Factors that drive the cost of a circuit board
Speaker: Mario Cianfriglia, NCAB Group Italy
Speaker: Mario Cianfriglia, NCAB Group Italy
14:00
Day-to-day solutions to original requirements.
Speaker: Gianluca Esposito, DVS Srl
Speaker: Gianluca Esposito, DVS Srl
09:30
PCB Layer Stack-up – Basic Knowledge and Design Considerations.
Speaker: Albert Schweitzer, Fineline Italia Srl
Speaker: Albert Schweitzer, Fineline Italia Srl
14:30
The future of PCB
Speaker: Marco Moreale, Eleprint Srl
Speaker: Marco Moreale, Eleprint Srl
10:15
Reliability product/process of Electronic Assembly.
Speaker: Roberto Lavelli, Preventlab
Speaker: Roberto Lavelli, Preventlab
15:00
FAE Technology R&I projects for fast prototyping of PCBA.
Speaker: Manuel Lobati, FAE Technology SpA – SB
Speaker: Manuel Lobati, FAE Technology SpA – SB
11:00
The IATF 16949 standard implementation on an industrial PCBA subcontractor’s context.
Speaker: Andrea Bevilacqua, Davide Bernardi, EAS SpA
Speaker: Andrea Bevilacqua, Davide Bernardi, EAS SpA
15:30
Impact of different surface finishes on insertion loss.
Speaker: Alex Ippich, ISOLA
Speaker: Alex Ippich, ISOLA
11:30
Advantages of ink-jet printing in electronic manufacturing.
Speaker: Gaetano Dall’Ora, DALLCO – NOTION
Speaker: Gaetano Dall’Ora, DALLCO – NOTION
16:00
Moldovan electronics industry overview
Speaker: Elena Maevski, Coordinatore del progetto presso l’Associazione delle aziende elettroniche della Moldavia (ACEM)
Speaker: Elena Maevski, Coordinatore del progetto presso l’Associazione delle aziende elettroniche della Moldavia (ACEM)
12:00
Rogers Corporation introduces a new low loss thermoset material at the same price point of a standars FR4 epoxy.
Speaker: Stefano Dadà, Rogers/Dralmi
Speaker: Stefano Dadà, Rogers/Dralmi
16:30
Our 20 years experience in the field of x-ray for the optimization of pin holes and pcb inspection.
Speaker: Roberto Brusa, MACH3 LAB Srl
Speaker: Roberto Brusa, MACH3 LAB Srl
12:30
Digitalization in the procurement process of the printed circuit board (PCB).
Speaker: Philipp Spies, Copperdot – grow platform GmbH
Speaker: Philipp Spies, Copperdot – grow platform GmbH
BREAK 13:00 – 14:00
Wednesday, 17th May 2023 – 1st Day
Schedule
Morning
09:30
| CADENCE MSA (Multiphysics System Analysis) for integrated design od Radio Frequency and Microwave PCBs.
Speaker: Luigi Scopelliti, ARTEDAS |
10:00
| Automated printing systems, label’s materials.
Speaker: Marco Minotti, BRADY ITALIA Srl |
10:30
| Micro-controllers market overview and its evolution during the chip-shortage.
Speaker: Leonardo Costa, Cognimade Srl |
11:00
| The importance of technology, the right solutions and partnership.
Speaker: Eric Jon Tonel, JO-TECH Srl |
11:30
| Ultra-High Density Interconnects- Mils to Microns.
Speaker: Anaya Vardya, American Standard Circuits |
12:00
| Gestlabs & Phoenix Contact: the ideal partnership for higher added value training.
Speaker: Patrick Panci, PHOENIX CONTACT SpA |
12:30
| PCB, is one as good as the other?
Speaker: Gianni Quartiroli, BASELECTRON |
BREAK 13:00 – 14:00
Afternoon
14:00
| The evolution of PCB Design.
Speaker: Alessandro Checchia, ACx Design Srl |
14:30
| State-of-the-art PCB drilling and milling solutions.
Speaker: Michael Rohrer, Atg electronics Srl SB |
15:00
| EPA Area.
Speaker: Nicoletta Frignani, Batter Fly Srl |
15:30
| All starts from Design”: how the electronic design has changed and which are the new challenges.
Speaker: Pietro Vergine, Leading Edge |
16:00
| Mass Interconnect systems for IC and PCBA testing. Speaker: Paolo Magni, ODU GmbH & Co. KG |
16:30
| Characterizing the impedance profile on printed circuit boards using the tdr technique.
Speaker: Maurizio Mastrofini, TELEDYNE LECROY Srl |
17:00
| Reducing bom cost offering an a.s.i.c. solution.
Speaker: Andrea Stona, KERR Srl |
17:30
| Controlled processes for longer lasting electronic products.
Speaker: Graziano Todaro, EES SpA |
Thursday, 18th May 2023 – 2nd Day
Schedule
Morning
09:00
Factors that drive the cost of a circuit board
Speaker: Mario Cianfriglia, NCAB Group Italy
Speaker: Mario Cianfriglia, NCAB Group Italy
09:30
PCB Layer Stack-up – Basic Knowledge and Design Considerations.
Speaker: Albert Schweitzer, Fineline Italia Srl
Speaker: Albert Schweitzer, Fineline Italia Srl
10:15
Reliability product/process of Electronic Assembly.
Speaker: Roberto Lavelli, Preventlab
Speaker: Roberto Lavelli, Preventlab
11:00
The IATF 16949 standard implementation on an industrial PCBA subcontractor’s context.
Speaker: Andrea Bevilacqua, Davide Bernardi, EAS SpA
Speaker: Andrea Bevilacqua, Davide Bernardi, EAS SpA
11:30
Advantages of ink-jet printing in electronic manufacturing.
Speaker: Gaetano Dall’Ora, DALLCO – NOTION
Speaker: Gaetano Dall’Ora, DALLCO – NOTION
12:00
Rogers Corporation introduces a new low loss thermoset material at the same price point of a standars FR4 epoxy.
Speaker: Stefano Dadà, Rogers/Dralmi
Speaker: Stefano Dadà, Rogers/Dralmi
12:30
Digitalization in the procurement process of the printed circuit board (PCB).
Speaker: Philipp Spies, Copperdot – grow platform GmbH
Speaker: Philipp Spies, Copperdot – grow platform GmbH
BREAK 13:00 – 14:00
14:00
Day-to-day solutions to original requirements.
Speaker: Gianluca Esposito, DVS Srl
Speaker: Gianluca Esposito, DVS Srl
14:30
The future of PCB
Speaker: Marco Moreale, Eleprint Srl
Speaker: Marco Moreale, Eleprint Srl
15:00
FAE Technology R&I projects for fast prototyping of PCBA.
Speaker: Manuel Lobati, FAE Technology SpA – SB
Speaker: Manuel Lobati, FAE Technology SpA – SB
15:30
Impact of different surface finishes on insertion loss.
Speaker: Alex Ippich, ISOLA
Speaker: Alex Ippich, ISOLA
16:00
Moldovan electronics industry overview
Speaker: Elena Maevski, Coordinatore del progetto presso l’Associazione delle aziende elettroniche della Moldavia (ACEM)
Speaker: Elena Maevski, Coordinatore del progetto presso l’Associazione delle aziende elettroniche della Moldavia (ACEM)
16:30
Our 20 years experience in the field of x-ray for the optimization of pin holes and pcb inspection.
Speaker: Roberto Brusa, MACH3 LAB Srl
Speaker: Roberto Brusa, MACH3 LAB Srl
Contacts
info@focusonpcb.it
+39 02 36753260
info@focusonpcb.it
+39 02 36753260
Opening hours Focus on PCB
15th of May – 9.00am – 6.00pm
16th of May – 9.00am – 5:00pm
15th of May – 9.00am – 6.00pm
16th of May – 9.00am – 5:00pm
Location
Vicenza Expo Centre – Pad. 1
Via dell’Oreficeria, 16 – Vicenza, Italy
Vicenza Expo Centre – Pad. 1
Via dell’Oreficeria, 16 – Vicenza, Italy
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