PCB: FROM DESIGN TO ASSEMBLY

Moderator: Massimo Cerofolini

10:30 am
We design with AI
Luca Pelliccioni, Technical Manager CTO MW-FEP S.p.A

11:00 am
Influence of copper foil on electrical performance in high frequency applications
Alexander Ippich, Technical Director Signal Integrity and Advanced Technology Isola Group

11:40 am
Is it correct to adapt production processes to correct a flawed design?
Graziano Todaro, General Manager EES S.p.A.

12:20 am
X-ray inspections on PCBA production
Andrea Bevilacqua, Technical Manager EAS S.p.A
Andrea Manni, thesis student, Electronic Engineering

02:00 pm
Via: Type, Use, function and reliabilities
Luca Pagnani, CTO, CISTELAIER S.p.A.
Alfonso Musto, Sales Area ManagerNorthern Italy, CISTELAIER S.p.A.

02:45 pm
PCB Design, more than just layout
Alessandro Checchia, CEO ACx Design

03:30 pm
Laboratory technologies and techniques for the study and characterization of bare and assembled printed circuit boards
Luca Moliterni; Mattia Cevasco, ESA/ECSS, IPC Instructors Istituto Italiano della Saldatura

04:15 pm
Silicon-to-Systems: New ways to approach Electronic Design
Dr Peter Tranitz, IPC Senior Director Solution (Germany)

Design for Compliance
Guro Krossen, Confidee Communications Manager (Norway)
Andrea Queirolo, Sales Manager (Italy)

ARTIFICIAL INTELLIGENCE AS A DRIVER OF CHANGE IN THE ELECTRONICS INDUSTRY

Moderator: Massimo Cerofolini

10:30 am
Artificial Intelligence and SMT Assembly: Transforming analytics and tracking with technology
Kamil Stasiak, Product Marketing Manager Yamaha Robotics

11:15 am
How European manufacturing can be reborn with technological innovation
Paolo Settimi, Production Process Consultant Mancini Enterprise SRL

12:00 am
How AI rewrites the rules: New Frontiers in SPI & AOI 3D
Michael Zahn, Europe Sales Manager Koh Young