Oak-Mitsui Technologies manufactures FaradFlex™ copper-clad laminates for PCBs used in power/ground layers to lower inductance, lower EMI noise, save real estate by reducing decoupling capacitors, and reduce PCB thickness. Oak-Mitsui also manufactures MicroThin™ ultra-thin copper foil for fine lines and spaces and VSP™ ultra-smooth copper foil for low conductor loss in high-speed PCBs.