SIAE MICROELETTRONICA S.p.A. – Stand 429

SIAE MICROELETTRONICA offers its experience and capabilities to provide build-to-print and co-design products. The SMT assembly line for assembling SiP, Chip on board, ultrafine pitch BGA and QFN components is monitored at every stage of the process via 3D control instrumentation (SPI and AOI) and platforms for In-Circuit Test (ICT) via “Bed of Nails” and “Flying Probes” technology.