1. TCLAD offers a range of PCB and PCBA solutions tailored for local customers. Which key products or technological innovations will you be showcasing at Focus on PCB 2026, and how do they help your clients improve efficiency, performance, or reliability?

We will present our metal-based PCB solutions with a strong focus on thermal management, including metal-based PCBs (aluminum/copper substrates), thermal interface materials (TIM) and thermal bridge, developed for high-power and high-reliability applications.
Our metal-based PCB solutions focus on efficient heat spreading and mechanical stability, while our TIM and thermal bridge products are designed to reduce interfacial thermal resistance and improve heat transfer between components, substrates, and heat sinks.
By optimizing material selection, layer structure, and bonding processes across these thermal interfaces, we help our customers achieve lower operating temperatures, improved reliability, and more stable long-term performance. These solutions also support application-specific customization, allowing engineers to balance thermal performance, electrical insulation, and manufacturability according to system requirements.

2. What convinced you to take part in Focus on PCB 2026, and what opportunities does this event offer compared to others?

We chose to participate in Focus on PCB 2026 because it is a technology-focused platform dedicated specifically to the PCB and electronics manufacturing industry, offering an environment well suited for technical exchange.

3. From your perspective, what technological innovations or challenges are shaping the future of the PCB industry, and how is your company addressing these changes?

Key challenges shaping the future of the PCB industry include increasing power density, tighter thermal constraints, higher reliability expectations, and the need for greater process consistency.
To address these challenges, we focus on board-level thermal solutions, combining metal-based PCBs with TIM and thermal bridge technologies. Through early-stage technical collaboration, material optimization, and controlled manufacturing processes, we help customers manage heat more efficiently while maintaining reliability and process consistency for high-performance applications.